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| SP721 100 TA = 25oC SINGLE PULSE 2.5 TA = 25oC SINGLE PULSE 80 FORWARD SCR CURRENT (mA) FORWARD SCR CURRENT (A) 2 60 1.5 40 1 IFWD EQUIV. SAT. ON THRESHOLD ~ 1.1V VFWD 20 0.5 0 600 800 1000 1200 FORWARD SCR VOLTAGE DROP (mV) 0 0 1 2 FORWARD SCR VOLTAGE DROP (V) 3 FIGURE 2. LOW CURRENT SCR FORWARD VOLTAGE DROP CURVE FIGURE 3. HIGH CURRENT SCR FORWARD VOLTAGE DROP CURVE +VCC +VCC INPUT DRIVERS OR SIGNAL SOURCES LINEAR OR DIGITAL IC INTERFACE IN 1 - 3 IN 5 - 7 TO +VCC V+ SP721 V- SP721 INPUT PROTECTION CIRCUIT (1 OF 6 SHOWN) FIGURE 4. TYPICAL APPLICATION OF THE SP721 AS AN INPUT CLAMP FOR OVER-VOLTAGE, GREATER THAN 1V BE ABOVE V+ OR LESS THAN -1VBE BELOW V- 6-11 SP721 Peak Transient Current Capability of the SP721 The peak transient current capability rises sharply as the width of the current pulse narrows. Destructive testing was done to fully evaluate the SP721's ability to withstand a wide range of peak current pulses vs time. The circuit used to generate current pulses is shown in Figure 5. The test circuit of Figure 5 is shown with a positive pulse input. For a negative pulse input, the (-) current pulse input goes to an SP721 `IN' input pin and the (+) current pulse input goes to the SP721 V- pin. The V+ to V- supply of the SP721 must be allowed to float. (i.e., It is not tied to the ground reference of the current pulse generator.) Figure 6 shows the point of overstress as defined by increased leakage in excess of the data sheet published limits. The maximum peak input current capability is dependent on the ambient temperature, improving as the temperature is reduced. Peak current curves are shown for ambient temperatures of 25oC and 105oC and a 15V power supply condition. The safe operating range of the transient peak current should be limited to no more than 75% of the measured overstress level for any given pulse width as shown in the curves of Figure 6. Note that adjacent input pins of the SP721 may be paralleled to improve current (and ESD) capability. The sustained peak current capability is increased to nearly twice that of a single pin. + VX R1 VARIABLE TIME DURATION CURRENT PULSE GENERATOR CURRENT SENSE (-) (+) 1 IN 2 IN 3 IN VOLTAGE PROBE 4 VSP721 V+ 8 IN IN IN 7 + 6 5 C1 - R1 ~ 10 TYPICAL VX ADJ. 10V/A TYPICAL C1 ~ 100F FIGURE 5. TYPICAL SP721 PEAK CURRENT TEST CIRCUIT WITH A VARIABLE PULSE WIDTH INPUT 7 6 5 4 3 2 1 0 0.001 0.01 0.1 1 PULSE WIDTH TIME (ms) 10 100 1000 TA = 105oC TA = 25oC CAUTION: SAFE OPERATING CONDITIONS LIMIT THE MAXIMUM PEAK CURRENT FOR A GIVEN PULSE WIDTH TO BE NO GREATER THAN 75% OF THE VALUES SHOWN ON EACH CURVE. V+ TO V- SUPPLY = 15V FIGURE 6. SP721 TYPICAL SINGLE PULSE PEAK CURRENT CURVES SHOWING THE MEASURED POINT OF OVERSTRESS IN AMPERES vs PULSE WIDTH TIME IN MILLISECONDS PEAK CURRENT (A) 6-12 SP721 Dual-In-Line Plastic Packages (PDIP) N E1 INDEX AREA 12 3 N/2 E8.3 (JEDEC MS-001-BA ISSUE D) 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL -B- MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 9.01 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 10.16 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93 MIN 0.015 0.115 0.014 0.045 0.008 0.355 0.005 0.300 0.240 MAX 0.210 0.195 0.022 0.070 0.014 0.400 0.325 0.280 -AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A2 L A C L E A A1 A2 B B1 C D D1 E -C- eA eC C e C A BS eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). E1 e eA eB L N 0.100 BSC 0.300 BSC 0.115 8 0.430 0.150 - 2.54 BSC 7.62 BSC 10.92 3.81 8 2.93 6-13 SP721 Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A L MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93 MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497 MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574 A1 B C D E A1 0.10(0.004) C e H h L N 0.050 BSC 0.2284 0.0099 0.016 8 0o 8o 0.2440 0.0196 0.050 1.27 BSC 5.80 0.25 0.40 8 0o 6.20 0.50 1.27 e B 0.25(0.010) M C AM BS NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 6-14 |
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